JEDEC and IPC Update Essential Component Assessment Standard, J-STD-020E

February 6, 2015 JEDEC Solid State Technology Association and IPC — Association Connecting Electronics Industries®  today announced the publication of an update to J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. This widely used joint standard is used to determine what moisture-sensitivity-level (MSL) classification should be so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies. The latest revision, J-STD-020E, is available from the JEDEC website or IPC website.

In this revision, clarification was added in numerous areas to ensure consistency in scope and application.  Namely, J-STD-020E enumerates references regarding J-STD-075 (process sensitive levels), JEDEC JESD-A113 (preconditioning/reflow) and JEDEC JEP160 (long term storage), and incorporates considerations for bare-die with polymer and non-IC package usage.  Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.

The development of J-STD-020E was spearheaded by JEDEC's JC-14.1 Subcommittee for Reliability Test Methods for Packaged Devices and by the IPC Plastic Chip Carrier Cracking Task Group (B-10a), and was assessed by both JEDEC and IPC in the final stages before publication.

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