IPC Releases 2017 Quality Benchmark Study for Electronics Assembly

October 4, 2017 — IPC's Study of Quality Benchmarks for Electronics Assembly 2017 is now available. The annual study provides valuable benchmarking data to electronics assembly companies interested in comparing quality measurements to industry averages.

The quality control measurements covered by the study include first-pass yields for various test methods as well as the percentages of products subjected to these tests. Yields and defect rates at final inspection, internal yields of key processes, defect rates, and DPMO and yield targets, and the average cost of poor quality as percentages of sales for rework and scrap are also covered. The study also reports on the use of various quality control methods.

Customer satisfaction and supplier performance metrics are covered in the study, including rates of customer returns and returns due to product failure, and rates of on-time delivery. The industry's adoption of major quality certifications is also reported.

The data — in averages, medians and percentiles — are segmented by company size tier, by region, and by type of production including rigid PCBs, flexible circuits, rigid backplanes, end products, mechanical assembly, cable and harness, and discrete wiring terminal and connectors.

The aggregate data represent 89 electronics assembly companies of all sizes – both OEMs and contract electronics manufacturers – in all regions of the world.

The 146-page report is available for sale to IPC members for $675 and to nonmembers for $1,350. For more information or to purchase the report, visit www.ipc.org/AssemblyBenchmark2017 or contact IPC's market research department at marketresearch@ipc.org. For information on other IPC market research programs, visit www.ipc.org/IndustryData.

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