IPC Assembly Quality Benchmark Study Open to Participants, Survey Deadline Extended to April 30

April 23, 2018 — The annual Quality Benchmark Study for Electronics Assembly, one of IPC’s most popular studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation has been extended to April 30.

This confidential survey is open to all companies that do electronics assembly worldwide, including OEMs and contract manufacturers. Participants who complete the survey will receive the report on the findings at no cost.

The study covers the industry's most widely used and important quality measurements, including yields, defect rates, cost of poor quality, test and inspection methods used, customer returns, supplier performance, certifications and more. Companies use the results to benchmark their operations to world-class quality measurements.

The report shows industry averages and percentile data by product type, region and company size tier. Product types covered in the survey include electronic end-products, rigid PCBs, flexible circuits and rigid flex, mechanical assembly, cable and wire harness, rigid backplanes, discrete wiring terminals and connectors. The report will be published in English and Chinese by September of this year.

IPC protects the confidentiality of participants’ data using a secure survey platform and server. IPC publishes only aggregate results and does not share any company-specific information. The survey asks for the participants’ IPC company ID number, which is used to provide additional data security.

Participants can start the 2018 Quality Benchmark Survey for Electronics Assembly or review the questionnaire in English at www.ipc.org/quality-benchmark-2018 and in Chinese at www.ipc.org/China-quality-benchmark-2018.

For assistance or to obtain the required company ID number, participants may contact IPC at +1 847-597-2868 or MarketResearch@ipc.org.

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