IPC Assembly Quality Benchmark Survey
Open to Participants Worldwide

April 24, 2019 — The 2019 Study of Quality Benchmarks for Electronics Assembly, one of IPC’s most popular annual studies, is currently underway. The survey is online and available in both English and Mandarin Chinese. The deadline for participation is May 17.

This confidential survey is open to all companies that do electronics assembly worldwide, including OEMs and contract electronics manufacturing service (EMS) companies. Participants who complete the survey will receive the report on the findings at no cost.

The study covers the industry's most widely used and important quality measurements, including yields, defect rates, cost of poor quality, rework, test and inspection methods used, inventory accuracy, customer returns, supplier performance, certifications and more. Companies use the results to benchmark their operations to world-class quality measurements.

The report will show industry averages and percentile data by product type, region and company size tier. Product types covered in the survey include electronic end-products and systems, rigid PCBs, flexible circuits and rigid flex, rigid backplanes, molded boards, MCM-C-L-D, mechanical assembly, cable and wire harnesses, and discrete wiring terminals and connectors. The report will be published in English and Chinese in August of this year.

IPC protects the confidentiality of participants’ data using a secure survey platform and server. IPC publishes only aggregate results and does not share any company-specific information. The survey asks for the participants’ IPC company ID number, which is used to provide additional data security.

Participants can access the survey in English at 2019QualityBenchmarkSurvey and in Chinese at 2019年IPC电子组装质量标杆调研项目. For assistance or to obtain the required company ID number, participants may contact IPC at +1 847-597-2868 or MarketResearch@ipc.org.

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