Emerging Technologies Take Center Stage at IPC Electronics Materials Forum
 New IPC technical conference features keynote by
autonomous auto expert Lenora Clark

September 11, 2019 — The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. Will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.

Geared toward engineers and managers that procure materials or seek an understanding of advancements in materials for the board, assembly, components and protective layers, the IPC Electronics Materials Forum will emphasize the emerging technologies that challenge the existing materials set. Interactive panels and networking opportunities will provide attendees an open forum to discuss solutions to challenges.

The Forum will feature a keynote by Lenora Clark, director, autonomous driving and safety technology for MacDermid Alpha Automotive, who will present insights into all aspects of electronics, uniting circuitry, semiconductor and assembly solutions to support future automotive market needs.

“You can envision many future technologies, but you cannot create them without materials and processes to manufacture them,” said Brook Sandy-Smith, technical conference program manager. “Emerging technologies that challenge our existing materials set will inform the developments needed for the future, and we have an impressive lineup of speakers, including Lenora Clark as our keynote, at IPC Electronics Materials Forum to lead the way.”

More than 20 companies will be represented at the Forum, including Continental Automotive Systems, Averatak, Calumet Electronics, Indium, Lockheed Martin and Raytheon, among others.

Topics to be presented include:

  • Semi-additive processes for high density interconnect
  • Additive textile manufacturing for electrical connections
  • SIR test method for underfill reliability in automotive electronics
  • Digitization of organic electronics information: Materials, manufacturing and devices
  • Reliable and cost-effective nickel-free solutions for high-frequency/high-density applications
  • Evaluation of PCB through hole plating, drill, and desmear quality for new laminate materials
  • Trends and developments in electronic protection materials

For more information about the IPC Electronics Materials Forum or to register, visit www.ipc.org/Materials-Forum-2019.

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