Best Technical Paper at IPC APEX EXPO Selected

February 10, 2015 — The best technical conference paper of IPC APEX EXPO 2015 has been selected. Voted on through a ballot process by members of IPC's Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 24.

Taking top honors, the winning paper is, "High Frequency Loss Test Methods for Laminate Materials Comparison (a High Density Packaging User Group/HDPUG Project)," by Karl Sauter, Oracle Corporation USA. His co-author was Joseph Smetana, Alcatel-Lucent. The paper will be presented during technical conference session 11 on Wednesday, February 26.

An honorable mention went to "Electroplated Copper Filling of Through Holes on Varying Substrate Thickness," by Jim Watkowski, MacDermid, Inc. His co-authors included: Kesheng Feng, Bill DeCesare, Mike Yu and Don DeSalvo, MacDermid, Inc. A second honorable mention was presented to, "Acceptance Testing of Low-Ag Reflow Solder Alloys," by Kris Troxel, Hewlett-Packard Company. Her co-authors were: Aileen Allen, Elizabeth Elias Benedetto and Rahul Joshi, Hewlett-Packard Company.

The papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing.

To register for the IPC APEX EXPO technical conference or for more information on all the activities taking place, including standards development meetings, professional development courses, or the exhibition, visit www.IPCAPEXEXPO.org.

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