“Smaller, Faster, Better, Cheaper” If you are involved in any aspect of the electronics manufacturing industry, you know that this is becoming the mantra of the supply chain. You also know that meeting the demands of these requirements is a never ending challenge. Where can OEMs, PCB manufacturers, EMS providers and their suppliers go for answers?

“Smaller, Faster, Better, Cheaper: Trends in Electronics Manufacturing” will be the focus of this year’s IPC Executive Market & Technology Forum European Conference, to be held in Brussels, Belgium, 29-30 November 2006. During this day and a half event, industry leaders will share their insights on the future of the electronics industry, as well as discuss developments at their companies. No other event focuses on the needs of top managers in our industry, presenting issues of strategic importance to your company. It also offers you a complete picture of the supply chain, from OEMs to equipment suppliers. This is an unprecedented opportunity to learn what the rest of the industry is planning and how it will impact your business.

What You will Learn
The conference begins with a keynote address by Marisa Blumenberg, Head Economist, Siemens Automation and Drives. Siemens has developed a forecasting tool that relies on hard economical numbers rather than forecasts and opinions from external companies. This forecasting tool is able to identify the shape of the cycle, its current position in the cycle and a forecast of that cycle predicting turning points with 90% accuracy. Ms. Blumenberg will demonstrate the methodology in connection with her forecast for the electronics industry. Not only will you get a preview of how the industry is going to develop in the next 12 months, but you will learn a valuable technique to strengthen your company’s forecasting ability.

Then, discover what industry leaders are doing to improve technology while lowering costs. In recent years, the trend has been to outsource to Asia to take advantage of cheaper labor and overhead. But, is Asia always the best option? Michael Gasch, Data4PCB, will discuss European sourcing alternatives. There will also be break-out sessions on choosing the best manufacturing locations in Eastern Europe, and on India’s future as an electronics production hub.

What new developments in markets and technologies will offer both challenges and opportunities for your business? Neil Moskowitz of Prismark Partners will share the findings of a new study and forecast on the worldwide medical electronics market. Nicholas Pearne, BPA Consulting, will present the results of IPC’s newly published commissioned study on high-speed electronic technology. Specifically, you will understand the market trends driving high-speed electronics system architectures and the anticipated technology requirements for these architectures. This presentation will also forecast market demand for high-speed PCBs and low loss laminates.

Materials will play a major role in meeting the demands of “smaller, faster, better, cheaper.” Dr. Neil Kirby, Chief Technology Officer for Parlex, will discuss innovative uses of flexible materials for electronics, including low cost materials and high value products. After Dr. Kirby’s talk, there will be concurrent sessions for EMS and PCB executives on the latest in next generation materials for their respective industries. In the EMS session, Malcolm Warwick of Henkel Loctite Adhesives will cover materials with a focus on the demands of convergence between traditional semiconductor and PCB assembly activities.

These are only a few of the issues to be addressed. There will also be sessions on equipment trends, proposed European environmental regulations and commodity cost impact on PCBs.

Register today! Simply print or download the registration form (.pdf). With registration questions contact IPC’s registration department at registration@ipc.org or telephone +1 847 597 2861. With questions regarding the conference, contact Ms Piyamart Hom-Uem at homupi@ipc.org or +1 847 597 2868.

Sponsorship Opportunities
Industry suppliers can enhance their exposure to current and prospective customers by becoming corporate sponsors of the conference. Three levels of sponsorship offer you a choice of package options. All sponsors will have their company name and logo included in upcoming marketing communications about the conference, which reach more than 13,000 of the industry’s top managers worldwide. Your name and logo will also be featured on the cover of the conference proceedings book, with contact information for your company featured inside the book. Prominently placed advertising space is also included in two of the packages. Your marketing literature will be displayed at the conference and all packages include one free delegate registration.

To sign up, access the sponsorship form (.pdf).

hotel information

IPC Executive Market & Technology Forum European Conference will be held at the Crowne Plaza Brussels Europa, Rue De La Loi 107, Brussels, 1040 Belgium. The hotel has guaranteed a rate of 185 Euro per night on single rooms (215 for doubles) for IPC guests, but only on reservations booked before November 6, 2006. To make hotel reservations, complete and send in this hotel reservation form (.pdf)

agenda Executive Forum Conference Wednesday, 29 November
9:00	Keynote Address: World Economic Assessment and Forecast for the Electronics Industry Ms Marisa Blumenberg, Head Economist for Electronics Assembly, Siemens Automation and Drives
10:00	Commodity Cost Impact on PCBs Mr Jerry Sax, Senior Vice President and Chief Financial Officer, Viasystems
10:45	Break
11:00	Manufacturing in Eastern Europe: Determining Your Start-Up Needs Mr Ron Bell, Director of European Operations CTS Automotive Products
11:40	India’s Future as an Electronics Production Hub: How Does it Compare with China? Mr A. Gururaj, Managing Director, Flextronics India
12:20	Sourcing in Europe — Is Asia Really Cheaper? Mr Michael Gasch, President, Data4PCB
13:00	Lunch
14:30	Innovative Uses of Flexible Materials for Electronics Dr Neil Kirby, Chief Technology Officer, Parlex
15:15	Break
15:30	Concurrent sessions: New PCB Assembly Materials Developments — Learning from Electronic Component Packaging Experience Dr. Malcolm Warwick, Global Business Director — Circuit Protection & Thermal Interface Materials, Henkel Loctite Adhesives High Reliability FR-4 Base Materials for Lead-Free Assembly Applications Mr David Humby, OEM Marketing Manager Europe, Isola Group
16:15	Concurrent sessions: New Trends in Assembly Equipment Mr Sjef van Gastel, Manager Advanced Development, Assembléon Netherlands B.V. Solder Mask Exposure with Laser Direct Imaging Mr Uwe Altmann, LDI Product Manager, Orbotech
17:00	Adjournment
17:30	Networking Reception and Dinner
Thursday, 30 November
9:00	The Future of High-Speed Electronic Technology: Highlights from IPC’s Newly Published Commissioned Study Mr Nicholas Pearne, Director, BPA Consulting
10:00	Higher Performance PCBs: Trends in Reliability, Functionality and Speed Mr Joan Tourné, Advanced Technology and Business Director, Viasystems
10:45	Break
11:00	Medical Electronics Market Opportunities for Interconnect Manufacturers: Highlights from IPC's Commissioned Study Mr Neil Moskowitz, Senior Consultant, Prismark Partners
12:00	The EuP Directive — Consequences in Ecodesign for Electronics Companies Dr Constantin Herrmann, Project Manager, PE Europe
13:00	Lunch followed by adjournment
What does “smaller, faster, better, cheaper” mean for assembly equipment? The IPC SMEMA Management Council Meeting is a special forum that explores the future of the assembly equipment industry. It is open to all senior managers in the assembly equipment industry. The afternoon before the Executive Forum conference, this private half day session will enable delegates to discover how to prepare for the trends that will impact their businesses. During the event, a panel representing the EMS and OEM industries will discuss what they need from their equipment suppliers to meet the demands of product miniaturization. Specifically, they will give insight into technology drivers and projected market trends so you can plan your company’s direction. A technology change is only one factor impacting your customer’s capital equipment choices. Understanding equipment-related costs is another important factor. In this session learn from leading OEM’s as they discuss how they develop and utilize cost of ownership models in their equipment choices. Valuable information you can use to educate your employee’s and your customers. Then, participate in roundtable discussions. This interactive session brings attendees together for a free flow exchange of ideas. How are other equipment executives solving common challenges? What are they doing to prepare for the future? This is a rare opportunity to learn from the collective knowledge of your peers. Register here (.pdf). For questions, contact Mr. John Kania at johnkania@ipc.org or +1 847 597 2806. Agenda 14:00 Welcome and Introduction to IPC SMEMA Council Pierre de Villemejane, President Speedline Technologies Chairman, IPC SMEMA Council 14:15 About IPC John Kania, Director of Government Relations and Assembly Industry Programs, IPC 14:30 Product Miniaturization and the Impact on the Capital Equipment Industry (Speaker to be announced) 15:30 Break 15:45 Understanding and Utilizing Cost of Ownership Models in the Capital Equipment Industry (Speaker to be announced) 17:00 Roundtable Discussion 18:00 Reception 19:00 Dinner 20:15 Closing Remarks/Adjourn