Description Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repaired. ... read more

Description As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufacturing. ... read more

Description Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critical part of electronics manufacturing. ... read more

Description The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. Since there are exemptions of which product types are mandated to go lead-free,and not all components will ... read more

Description This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit Assembly (PCA) testing utilizing the test access port (TAP) defined in IEEE Std. 1149.1. The test equipment under ... read more

Description Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be available to support this claim. ... read more

Description The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,higher operating speeds from 2 GHz to 10 GHz,effective thermal dissipation all in a low cost package. ... read more

Description As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. ... read more

Description Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The most common choices to find manufacturing defects on printed circuit boards are manual visual inspection (MVI),solder ... read more

Description As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing and nondestructive testing of printed circuit boards and electronic assemblies has grown at an unprecedented rate. ... read more

Description Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes. While some companies are taking advantage of the situation and are using “lead-free” as a major marketing initiative in the ... read more

Description Fully automatic X-ray Inspection (AXI) is an established technique for inspecting component mounting and solder joint integrity on PCBA’s. It is occasionally used for the detection of faults on (or more precisely,under) press fit connectors. ... read more