Lead-free Nanosolders and Nanowire Joining for Microelectronics/Nanoelectronics Assembly and Packaging

Description - Nanosolder on multi-segment nanowires have been successfully fabricated by electrodeposition method; - Flux assisted environment enhanced reflow result and micron scale solder spheroids formed on non-wetting Si substrate; ... read more
Author(s)
Fan Gao,Zhiyong Gu,Sammy Shina
Event
IPC APEX EXPO 2013