Description SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs in the 1990’s and the JCAA-JGPP program of the early 2000’s. ... read more

Description Multiple soldering assembly steps are essentially standard for PWBs based on current technologies and needs. A variety of tests are currently in use to evaluate the performance of finished PWBs,and indirectly,the materials and material performance of ... read more

Description Accelerated testing of plated hole life is necessary for economic reasons due to the long time to failure during field operating conditions. One difficulty in performing accelerated testing on plated holes is to decide which acceleration model to use. ... read more